Ready Stock Hexachlorodisilane with 99 9999% Purity for CVD Applications

Product Description

Production and QC Process

The production of electronic grade HCDS involves five key steps. It starts with catalytic synthesis of silicon sources under controlled thermal conditions. This is followed by multi-stage vacuum distillation to remove impurities. Advanced adsorption using chemical molecular sieves targets sub-ppb metallic contaminants. Quality is confirmed via real-time APIMS and ICP-MS testing. Finally, automated gravimetric filling occurs within a Class 10 cleanroom using a robotic arm, ensuring zero contamination for leading-edge fabs.

Gas Detection Process

The gas detection process ensures industrial safety through a five-step monitoring workflow. It begins with sample collection using a specialized probe, followed by sensor preheating to 120°C for equipment stabilization. Precise detection identifies gas concentrations in real-time, shown in ppm on digital monitors. Data is automatically logged for recording. The process concludes with an immediate alert, triggering a red beacon and alarm if safety thresholds are breached, ensuring reliable protection.

HCDS Containment Science

Focused on bubbler engineering, this process uses electropolished 316L stainless steel for a mirror finish with Ra<0.1μmRa<0.1μm. This eliminates micro-voids, preventing metallic ion leaching and particle trapping. Zero-leak delivery is ensured through dual diaphragm valves and high-integrity VCR seals, guaranteeing moisture-free transport. Each unit undergoes UHP Helium leak testing at 1.0×10−91.0×10−9 mbar.l/s for atomic-level integrity. The result is a high-purity containment vessel engineered for critical semiconductor applications and UHP gas delivery.

HCDS Targeted Applications

This graphic shows the application process for Trimethylaluminum (TMA), a universal aluminum source used in Atomic Layer Deposition (ALD) to form ultra-thin Al2O3Al O3 dielectric layers on logic chips. It supports 3D NAND stacking through high-aspect-ratio conformal coating and AlGaN epitaxial growth for high-brightness LEDs. It also covers solar passivation for PERC/TOPCon cells and gas barrier layers for flexible OLEDs. The final outcome is enhanced electrical performance and protective coating in advanced microelectronics and compound semiconductors.

Certifications and Compliance

The certification process validates safety and quality for ESG supply, involving ISO 9001 management certification and official licenses for pressure vessel filling. Manufacturing is supervised under Special Equipment Manufacturing standards, followed by high-precision batch inspections for aluminum and steel cylinders, checking dimensions and burst pressure. Compliance is finalized through reports matching US DOT and ISO 7866:2012 regulations. This rigorous documentation process ensures all gas solutions meet global safety standards and quality controls.

Specification

Technique Data	Guaranteed	Typical
Purity	≥ 99.9999%	99.99995%
Total content of metal impurities	≤ 50 ppb	< 10 ppb
Fe	≤ 5 ppb	< 1 ppb
Al	≤ 5 ppb	< 1 ppb
Cu	≤ 2 ppb	< 0.5 ppb
Ti	≤ 2 ppb	< 0.5 ppb
HCl	≤ 10 ppm	< 5 ppm

Packing & Delivery

Our HCDS is supplied in UN-certified SS316L EP bubblers, ensuring 6.5N purity. As a moisture-sensitive corrosive, it is shipped via specialized DG logistics under inert gas shielding. Featuring leak-proof double-valve systems and lot-specific COAs, we guarantee safety and zero contamination. Ideal for advanced ALD/CVD and dielectric deposition, our professional handling ensures consistent performance for FinFET and DRAM fabrication. Precision and safety in every cylinder.

Company Profile

Jiangsu Kaimei Electronic Materials Co., Ltd.

As a leading innovator in electronic specialty gases, we excel in R&D, manufacturing, and global supply of ultra-high purity solutions. Our expertise delivers products up to 6.5N purity, supported by SEMI-standard quality control and ICP-MS analysis. With state-of-the-art facilities and a resilient supply chain, we ensure stable delivery and expert technical services. Committed to semiconductor and solar excellence, we blend technology and reliability with safety and precision. We are your partner in high-tech growth.

Production Proces

Workshop equipment

Hop Test Checklist

For Japanese Clients: Focus on Precision & 5N

For Korean Clients: Focus on Tech & R&D

For Indian Clients: Focus on Compliance & Scale

Precision in Every Detail Experience Monozukuri at our facility. We invite Japanese partners for an audit on 5S and ppb-level precision. Our ISO-certified lines and strict SOPs ensure zero-defect quality and stable supply. Let's build trust through detail. Book your visit now.

Next-Gen Tech Synergy Partner with the leader in 6.5N electronic gases. Korean partners are welcome to audit our automated lines and R&D center. Focused on tech innovation and supply resilience, we ensure synergy and quick response for your fab needs. See our next-gen facility in action. Join us.

Global Standards, Massive Scale Scale your growth with our compliant hub. For Indian partners, we offer a transparent audit of our T21/T22 tank capacity and ESG-driven EHS systems. Certified by ISO/SGS, we ensure safe, large-scale supply with world-class safety protocols. Schedule your audit today.

FAQ

Q1: What is the purity level of your HCDS? Do you provide detailed impurity control reports?
A: We supply Electronic Grade HCDS with purity up to 99.9999% (6N). For advanced nodes (14nm and below), we control key trace metal impurities (Fe, Al, Cu, Ti) to <10 ppb. Every batch comes with a comprehensive COA based on ICP-MS testing, ensuring superior film consistency in 3D NAND and FinFET manufacturing.

Q2: HCDS is extremely moisture-sensitive. How do you ensure safety during transportation and storage?
A: We prioritize safety for all pyrophoric and corrosive precursors. Our HCDS is packaged in UN2987 Class 8 compliant high-strength stainless steel bubblers (cylinders) with precision VCR fittings and dual-valve systems for 100% hermetic sealing. We recommend storage at <5°C in a dry, inert gas environment. Our logistics team specializes in Class 8 hazardous materials, ensuring global compliance and smooth customs clearance.

Q3: What are the primary advantages of using HCDS over traditional DCS (Dichlorosilane) in ALD/CVD processes?
A: The main advantage is low-temperature efficiency. HCDS enables high-quality SiNx and SiO2 film growth at temperatures below 400°C, crucial for protecting temperature-sensitive underlying layers. Furthermore, HCDS offers exceptional step coverage in HAR structures, making it the preferred Si-precursor for complex 3D NAND vertical stacking and FinFET spacer applications.

Q4: Can you provide technical support for ALD/CVD process integration?
A: Absolutely. Our technical team has extensive experience with semiconductor precursors and equipment compatibility (e.g., ASM, Tokyo Electron, Applied Materials). We can provide recommended flow rates (sccm), saturation temperatures, and pulse/purge timing to help you optimize Growth Per Cycle (GPC) and resolve issues like energetic deposits or film non-uniformity.